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氮化镓(GaN)

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技术参数

  氮化镓晶片

  Free-standing GaN Substrates (Customized size)

  生长方法: HVPE,氢化物气相外延,

  性能参数Specifications:

产品型号Item

GaN-FS-10

GaN-FS-15

尺寸Dimensions

10.0mm×10.5mm

14.0mm×15.0mm

孔洞密度Marco Defect Density

A Level

0 cm-2

B Level

≤ 2 cm-2

厚度Thickness

Rank 300

300 ± 25 µm

Rank 350

350 ± 25 µm

Rank 400

400 ± 25 µm

晶体取向Orientation

C-axis(0001) ± 0.5°

TTV(Total Thickness Variation)

≤15 µm

弯曲度BOW

≤20 µm

导电类型Conduction Type

N-type

Semi-Insulating

电阻率Resistivity(300K)

< 0.5 Ω·cm

>10E6 Ω·cm

位错密度Dislocation Density

Less than 5x106 cm-2

有效面积Useable Surface Area

> 90%

抛光Polishing

Front Surface: Ra < 0.2nm. Epi-ready polished

Back Surface: Fine ground

包装Package

Packaged in a class 100 clean room environment, in single wafer containers, under a nitrogen atmosphere.

 

   

  性能参数Specifications:

产品型号Item

GaN-FS-N-1.5

尺寸Dimensions

Ф 25.4mm ± 0.5mm

Ф 38.1mm ± 0.5mm

Ф 45.0mm ± 0.5mm

孔洞密度Marco Defect Density

LD Level

> 90%

LED Level

> 78%

厚度 Thickness

300 ± 25 µm

晶体取向Orientation

C-axis(0001) ± 0.5°

主定位边Orientation Flat

(1-100) ± 0.5°, 12 ± 1mm

 

次定位边Secondary Orientation Flat

(11-20) ± 3°, 6 ± 1mm

TTV(Total Thickness Variation)

≤15 µm

弯曲度BOW

≤20 µm

导电类型Conduction Type

N-type

Semi-Insulating

电阻率Resistivity(300K)

< 0.5 Ω·cm

>106 Ω·cm

位错密度Dislocation Density

Less than 5x106 cm-2

有效面积Useable Surface Area

> 90%

抛光Polishing

Front Surface: Ra < 0.2nm. Epi-ready polished

Back Surface: Fine ground

包装Package

Packaged in a class 100 clean room environment, in single wafer containers, under a nitrogen atmosphere.

         
 

配件详情: