Technical Parameter

  Gallium nitride belongs to the third generation of semiconductor material with hexagonal wurtzite structure. It has the characteristics of large forbidden band width, high thermal conductivity, high temperature resistance, radiation resistance, acid and alkali resistance, high strength and high hardness. It has broad application potential and good market prospects in the fields of high-brightness blue, green, purple and white light diodes, blue and purple lasers, and anti-radiation, high-temperature and high-power microwave devices.

  Specifications:

  

Item

GaN-FS-10

GaN-FS-15

Dimensions

10.0mm×10.5mm

14.0mm×15.0mm

Marco Defect Density

A Level

0 cm-2

B Level

≤ 2 cm-2

Thickness

Rank 300

300 ± 25 µm

Rank 350

350 ± 25 µm

Rank 400

400 ± 25 µm

Orientation

C-axis(0001) ± 0.5°

TTV(Total Thickness Variation)

≤15 µm

BOW

≤20 µm

Conduction Type

N-type

Semi-Insulating

Resistivity(300K)

< 0.5 Ω·cm

>106 Ω·cm

Dislocation Density

Less than 5x106 cm-2

Useable Surface Area

> 90%

Polishing

Front Surface: Ra < 0.2nm. Epi-ready polished

Back Surface: Fine ground

Package

Packaged in a class 100 clean room environment, in single wafer containers, under a nitrogen atmosphere.

 

   

  Specifications:

  

Item

GaN-FS-N-1.5

Dimensions

Ф 25.4mm ± 0.5mm

Ф 38.1mm ± 0.5mm

Ф 45.0mm ± 0.5mm

Marco Defect Density

LD Level

> 90%

LED Level

> 78%

Thickness

300 ± 25 µm

Orientation

C-axis(0001) ± 0.5°

Orientation Flat

(1-100) ± 0.5°, 12 ± 1mm

Secondary Orientation Flat

(11-20) ± 3°, 6 ± 1mm

TTV(Total Thickness Variation)

≤15 µm

BOW

≤20 µm

Conduction Type

N-type

Semi-Insulating

Resistivity(300K)

< 0.5 Ω·cm

>106 Ω·cm

Dislocation Density

Less than 5x106 cm-2

Useable Surface Area

> 90%

Polishing

Front Surface: Ra < 0.2nm. Epi-ready polished

Back Surface: Fine ground

Package

Packaged in a class 100 clean room environment, in single wafer containers, under a nitrogen atmosphere.

         
 

Accessories Details: