Technical Parameter

  Silicon crystals are used as a semiconductor material, high-power transistor, rectifier, solar cells, etc.

  

Main performance parameters

Crystal structure

face-centered cubic

Melting poingt(℃)

1420

Density

2.4(g/cm3)

Dopant

Undoped

Boron

Phosphorus

Conduction type

I

P

N

Resistivity

Ø 1000Ωcm

10-3~1000Ωcm

10-3~1000Ωcm

EPD

≤100∕cm2

≤100∕cm2

≤100∕cm2

Oxygen content(∕cm3)

≤1~1.8×1018

≤1~1.8×1018

≤1~1.8×1018

Carbon content(∕cm3)

≤5×1016

≤5×1016

≤5×1016

Dimension

5x5mm ,10×10mm、20×20mm,

Ø50.8mm, Ø76.2mm, Ø100mm

Special direction and size of the substrate can be customized according to the customer need

Thickness

0.5mm、1.0mm

Dimension tolerance

<±0.1mm

Thickness tolerance

<±0.025mm

Polishing

One side or two sides

Orientation tolerance

±0.5°

Flat orientation tolerance

2°(special  requirements 1°)

Orientation

<100>、<110>、<111>等

Packing

Class 100 clean bag, Class 1000 clean room

 

Accessories Details: